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Logitech PM5精密研磨拋光系統(tǒng)是帶有一個(gè)工作站的臺(tái)式機(jī)，適用于科學(xué)研究水平的研磨和拋光，能夠完成4英寸及以下尺寸樣品的小批量處理。具有加工樣品*性高、規(guī)格水平高、表面光潔等特點(diǎn)。 -
The Logitech WSB unit offer premium bonding for the processing of fragile semiconductor wafers such as Silicon and Gallium Arsenide. -
The AWS1 Abrasive Wire Saw allows fragile or diffi cult materials to be cut or wafered without fear of the samples being damaged. Designed for use in photonics, semiconductor, opto-electronics -
Chemicals typically used in prime face polishing of semiconductor wafers or electronic and optoelectronic crystals, such as Bromine Methanol or acid etches, are highly aggressive and require ...... -
CMP Tribo 臺(tái)式化學(xué)機(jī)械研磨拋光設(shè)備,The Tribo CMP system is a precision engineered, bench top solution designed with one thing in mind - the research of wafer processes, including their associated wafer, pad and slurry interactions. -
Logitech CP3000化學(xué)拋光設(shè)備能很好的滿足腐蝕拋光溶劑，同樣也適用于腐蝕性較弱的Chemlox拋光，如半導(dǎo)體晶片的背拋光。現(xiàn)在的電子器件對(duì)于晶片尺寸，表面平整度、平行度及厚度控制都有非常苛刻的控制要求，而CP3000化學(xué)拋光機(jī)，特別是跟Logitech的晶片處理系統(tǒng)配合使用作為Z后一個(gè)步驟時(shí)，能*達(dá)到這些控制標(biāo)準(zhǔn)。
